Sign In

Login

Forgot your password?

Create Account

Register

How to solder a SMD IC – How to use Stencils – JLCPCB Stencils

How to solder a SMD IC - How to use Stencils - JLCPCB Stencils



Cheap & Fast PCB supplier https://jlcpcb.com (2$ only for 100*100mm pcb)

The sole purpose of an SMT stencil is to transfer solder paste to a bare circuit board. A stainless steel foil is laser cut creating an opening for every surface mount device on the board. Once the stencil is properly aligned on top of the board, solder paste is applied over the openings (making a single pass, using a metal squeegee blade). When the stainless steel foil is separated from the board, solder paste will remain, ready for placement of the SMD. This process, as opposed to hand soldering methods, ensures consistency and saves time.

Stainless steel foil thickness and aperture opening size control the volume of paste deposited on the board. Too much solder paste causes solder balling, bridging, and tomb-stoning. A lack of solder paste creates insufficient solder joints. All of which compromise the electrical functionality of the board.

Proper foil thickness is chosen based on the types of devices...

source

List your electronic components at BuySellComponents.com

Tags: smd ic

About the Author

4 Comments

Leave a Comment