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3D IC – Opportunities, Challenges, and TRUE 3D IC

3D IC - Opportunities, Challenges, and TRUE 3D IC



Device scaling faces it limitation. No cost advantage could be expected from device scaling any more. So, 3D IC seems the only option for the semiconductor industry. However, it is not possible to implement "Logic IC on top of Logic IC" Instead "memory of top of Logic IC" provides significant cost and performance advantages.

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Tags: integrated circuits

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